*Data last updated: 2026-04-24 00:37 (UTC+8)
As of 2026-04-24 00:37, ASML Holding N.V. (ASML) is priced at $1.422,48, with a total market cap of $556,41B, a P/E ratio of 36,81, and a dividend yield of %0,25. Today, the stock price fluctuated between $1.396,62 and $1.450,04. The current price is %1,85 above the day's low and %1,90 below the day's high, with a trading volume of 2,60M. Over the past 52 weeks, ASML has traded between $662,46 to $1.547,25, and the current price is -%8,06 away from the 52-week high.
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ASML Holding N.V. (ASML) Latest News
TSMC Sticks with Existing EUV Tools, Delays High-NA Adoption; A13 Process Targeted for 2029
Gate News message, April 23 — TSMC unveiled new manufacturing and packaging technologies designed to make chips smaller and faster, while announcing it will continue using existing ASML EUV machines rather than adopting newer High-NA lithography tools. The company's A13 process is targeted to enter production in 2029, while N2U represents a lower-cost option for smartphone, laptop, and AI chips. By 2028, TSMC aims to package 10 large chips with 20 memory stacks, compared to Nvidia's Vera Rubin design which features two compute chips and eight memory stacks. The decision contrasts with competitors moving faster on High-NA technology. Intel has already installed ASML's Twinscan EXE:5200B High-NA system and expects risk production in 2027 with volume output in 2028. Samsung received its first High-NA scanner in late 2025 and a second in the first half of 2026, while SK Hynix installed a High-NA EUV tool in September 2025. TSMC's choice reflects cost and risk considerations rather than a full dismissal of High-NA EUV technology. Analysts noted that challenges including heat management, material expansion, and cracking remain unresolved. ASML maintains a near-monopoly in EUV systems, with ZEISS SMT, Lam Research, and Applied Materials positioned to benefit from the spending wave. Chinese chipmaker SMIC remains unable to purchase EUV tools under export restrictions.
2026-04-22 06:22SK Hynix to Invest $12.85B in Advanced AI Memory Packaging Plant in South Korea
Gate News message, April 22 — SK Hynix announced plans to invest 19 trillion won (approximately $12.85 billion) in a new advanced packaging facility in South Korea, with construction set to begin this month to address rising demand for AI memory chips. The plant, designated P&T7 and located in Cheongju next to the company's M15X wafer production facility, will focus on high-bandwidth memory (HBM) packaging and testing. At approximately 231,400 square meters, it is expected to rank among the world's largest HBM packaging sites. The co-location of wafer production and packaging aims to accelerate manufacturing efficiency. SK Hynix also announced it would spend 20 trillion won (approximately $13.6 billion) in 2025 on capacity expansion, including accelerating the opening of another memory chip plant in South Korea. The investment is part of a three-part packaging strategy that includes existing operations in Icheon and a planned $4 billion advanced packaging and research hub in West Lafayette, Indiana. The company has also ordered chipmaking equipment worth 12 trillion won (approximately $7.97 billion) from ASML, the Dutch semiconductor equipment supplier.
2026-04-17 01:41TSMC and ASML Signal Continued Heavy AI Spending from Microsoft, Meta, Amazon
Gate News message, April 17 — TSMC and ASML's strong outlooks this week indicate that Microsoft, Meta, and Amazon will maintain substantial spending on AI chips and data centers in the coming quarter. TSMC announced plans to increase capital expenditure to expand its constrained production capacity, while ASML raised its annual revenue forecast and indicated that demand is expected to remain above supply levels. Data center spending is projected to exceed $600 billion this year. The four major hyperscalers—Microsoft, Meta, Alphabet, and Amazon—are forecast to spend nearly $700 billion on capital expenditure in 2026, a figure comparable to Sweden's entire economy. The signals point to sustained demand for chip designers including Nvidia, AMD, and Broadcom, even as investors press big tech firms to demonstrate clearer returns on AI investments. Capacity constraints are driving the trend. To secure scarce chip supply, some cloud computing and AI infrastructure buyers are entering take-or-pay contracts, which mandate payment for minimum semiconductor wafer quantities regardless of usage. For chipmaking equipment and semiconductor suppliers, such agreements provide greater visibility into orders and steadier cash flows, supporting capacity expansion efforts.
2026-03-06 14:41The three major U.S. stock indices opened sharply lower, and cryptocurrency concept stocks declined across the board.
Gate News reports that on March 6, the U.S. stock market opened sharply lower. The Dow Jones Industrial Average fell 1.28%, the S&P 500 declined 1.22%, and the Nasdaq dropped 1.45%. Major tech stocks generally declined, with ASML (ASML.O) down over 5%, TSMC (TSM.N) down nearly 3%, and Amazon (AMZN.O), Nvidia (NVDA.O), and AMD (AMD.O) each falling about 2%. In the cryptocurrency-related stocks sector, MSTR dropped 3.07%, COIN fell 2.40%, CRCL declined 0.67%, SBET decreased 4.51%, and BMNR dropped 5.07%.
2026-03-04 14:32The three major U.S. stock indices opened higher, with the Dow Jones up 0.37%
ChainCatcher reports that according to Gate market data, at the opening of the U.S. stock market, the Dow Jones Industrial Average rose 0.37%, the S&P 500 increased 0.3%, and the Nasdaq Composite gained 0.45%. Major tech stocks generally rose, with Micron Technology up nearly 4%, ASML up 2.6%, and both Tesla and TSMC increasing over 1%.










































































































































































































































































