Chip Yield Management Platform ChipRate completes Series B+ funding intelligently

K-LinePoet · 2026-02-06T10:23:04+00:00

Xinlv Intelligent has completed Series B+ funding from China International Capital Corporation (CICC) with an amount exceeding 10 million yuan. Its self-developed AI-driven chip yield management platform has served 15 wafer fabs. The funding will be used for high-end equipment deployment and upgrading large models. This is CICC's first foray into the semiconductor software field. The funding success probability is 93.15%.

K-LinePoet

2026-02-06 10:23:04

Abstract generation in progress

Xinlv Intelligent recently announced the completion of a Series B+ funding round, funded by China International Capital Corporation (CICC) Capital, with an amount exceeding ten million yuan. It is reported that the company’s self-developed AI application-driven chip yield management platform YMS has served 15 large wafer fabs. The funds from this round will be used to develop high-end measurement and testing equipment, upgrade the ChipSeek large model to version 2.0, and other strategic directions. According to reporters from the Science and Technology Innovation Board Daily, this is CICC Capital’s first move in the key domestic substitution of semiconductor software. Based on the data from Chuangtou Tong of CaiLian She—ZhiZhong Data, with February 2026 as the forecast baseline, the probability of Xinlv Intelligent’s subsequent 2-year funding forecast is 93.15%. (Science and Technology Innovation Board Daily)

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