Japanese companies develop technology to produce 1.4-nanometer semiconductors with 1/10 of the power consumption

DNP (Dainippon Printing) has developed technology capable of producing advanced semiconductors with one-tenth of the power consumption. A new manufacturing method for Canon’s production equipment will be mass-produced by 2027, supporting core components for next-generation 1.4-nanometer (1 nanometer = one-billionth of a meter) products. The manufacturing costs of AI semiconductors could be significantly reduced.

Currently, to mass-produce the most advanced semiconductors, you need to use extreme ultraviolet (EUV) lithography machines produced only by ASML Holdings in the Netherlands. The “lithography process” that patterns circuits on wafers accounts for 30% to 50% of total semiconductor manufacturing costs. The finer the circuit, the more lithography steps are required, increasing power consumption. An EUV lithography machine costs around 30 billion yen, imposing a heavy investment burden on semiconductor manufacturers.

Canon’s “Nanoimprint” manufacturing equipment uses a stamp-like method to create circuits on wafers. DNP has developed a circuit template comparable to a fine stamp, capable of supporting up to 1.4-nanometer process technology. Previously, this technology could not support the manufacturing of advanced semiconductors like 2-nanometer chips.

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